LED heat sink substrate future development trend

The main function of the heat sink substrate is to provide the power and heat transfer medium required for the LED. A good LED heat sink can transfer the heat of 80-90. Such a heat sink substrate is a good substrate. The current development of the LED industry is also focused on the development of high-power, high-brightness, small-size LED products. The above three factors will make the LED's heat dissipation efficiency higher and higher, but the LED is limited to the package size and other factors, and cannot be used too much. Active heat dissipation mechanism, therefore, providing a heat sink substrate with high heat dissipation and precision dimensions has also become a trend in the future development of LED heat sink substrates. The heat dissipation substrate has different design according to the circuit design, LED type and power size, and the reliability and price of the product are the most important specifications for determining the heat dissipation design. The main function of the heat sink substrate is to provide the power and heat transfer medium required for the LED. A good LED heat sink can transfer the heat of 80-90. Such a heat sink substrate is a good substrate. Conventional LEDs do not have a large heat dissipation due to the small amount of heat generated by the LEDs. Therefore, a general copper foil printed circuit board (PCB) can be used. But with the increasing popularity of high-power LEDs, PCBs are no longer sufficient to meet cooling needs. Therefore, it is necessary to attach the printed circuit board to the metal plate, the so-called MetalCore PCB, as shown in the figure to improve the heat transfer path. In addition, there is also a method of directly forming an insulating layer or a dielectric layer on the surface of the aluminum substrate, and then forming a circuit layer on the surface of the dielectric layer, so that the LED module can directly bond the wires to the circuit layer. At the same time, in order to avoid increasing the thermal impedance due to the poor thermal conductivity of the dielectric layer, a perforation method is sometimes adopted, so that the heat spreader at the bottom end of the LED module directly contacts the metal substrate, that is, the so-called chip is directly adhered. Depending on the metal substrate used, it is divided into copper-based copper clad laminates, aluminum-based copper clad laminates, and iron-based copper clad laminates. Generally, aluminum substrates are widely used for LED heat dissipation, and are the most widely used substrates for high-power LEDs. At the same time, due to the rapid development of LED consumer market in various fields, higher requirements are placed on the heat dissipation of LEDs, and LED heat sink substrates have gradually become a new market. Therefore, some companies have invested a lot of manpower and material resources in the research and development of high-power heat-dissipating substrates, and have made great progress.